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hebei i.t.(shanghai) co.,ltd. part no./ _ ? ? 530lb5c led specification www.hebeiltd.com.cn pa features/ (m u ? single color/ )8f high bright output/ p??zeg? low power consumption/ "s5? high reliability and long life/ ?m4?p??
qks descriptions/ e? ? dice material/ 8?($b? ingan emitting color/ np8f? super bright blue/ p??z:8f device outline/ {
?6? ? 5mm round type/ 5mm 6 lens type 6'np8f? water clear/ 8fe?a 1. all dimensions are millimeters/ )!? mm. 2. tolerance is +/-0.2 5mm unless otherwise noted/ "uy?"?,x@a f 0.25mm. directivity/ ? ? (m ? ? ta=25 c if=20ma relative luminous 0 90 0.5 1.0 0 radiation angle 60 30 0.5 0 directivity 30 1.0 90 60 g e: 1 of 3
hebei i.t.(shanghai) co.,ltd. part no./
_ ? ? 530lb5c www.hebeiltd.com.cn led specification pa g e: 2 of 3 absolute maximum ratings/ u l$ ? d ? ta = 25 ? values d parameter ?d symbol 0 ? test condition #a?5 min. max. unit )! reverse voltage ? ?+ _ v r i r = 30 - a 5 -- v forward current !7 ?10+ # i f ---- ---- 25 ma power dissipation 35?s)[ p d ---- ---- 90 mw pulse current !7 ??+ # i peak duty=0.1ms 1khz ---- 100 ma operating temperature 10#yz8 t opr ---- -40 +85 storage temperature |,#yz8 t str ---- -40 +100 electrical and optical characteristics/ + ? d ? ta = 25 ? values d parameter ?d symbol 0 ? test condition #a?5 min. typ. max. unit )! forward voltage !7 ?+ _ v f i f =20ma ---- 3.2 3.6 v reverse current ? ?+ # i r v r =5v ---- ---- 30 - a dominate wavelength "?ks ? d i f =20ma ---- 455 ---- nm peak wavelength ?"?ks ? p i f =20ma ---- 457 ---- nm spectral line half-width "?ks?z ? ? i f =20ma ---- 20 ---- nm luminous intensity z i v i f =20ma ---- viewing angle ? ??|z 2 ? 1/2 i f =20ma ---- 36 ---- deg. 1500 ---- mcd
hebei i.t.(shanghai) co.,ltd. part no./ _ ? ? 530lb5c led specification www.hebeiltd.com.cn pa typical electrical/optical characteristic curves/ + (m ? ? 4? ? g.5 , vs. "?ks 700 650 400 100 wavelength ? (nm) 0 g e: 3 of 3 fi ?z relative luminous intens 75 ity 50 25 550 600 500 450 relative luminous intensity 2.0 2.5 am -40 -20 bient temp e t a ( 020 0 90 60 eratur 40 ) 80 0.5 1.0 1.5 fig.3 !7 ?+ # vs. )?w#yz fig.4 ,?z vs. )?w#yz ,?z + # !7 ?+ # vs. _ 50 40 1.5 20 10 0 4.0 3.2 50 rward volta s intensity rel e value at if=20ma if-forward current (ma) 100 80 60 mperature fig.2 vs. !7 ? fig.1 !7 ?+ 2.0 0 2.8 2.4 2.0 1.0 2.5 40 t(ma 20 forward curr 30 en 50 0.5 luminou ativ 30 0 10 3.6 ge(v) fo ) 40 20 40 20 0 nt te 10 0 ambie t a ( ) forwar nt( d curre 30 ma)
bin code iv(mcd) bin code iv(mcd) bin code iv(mcd) bin code iv(mcd) a 0-5.0 h 37.2-52.0 q 390-550 x 4180--5860 b 5.0-7.0 j 52.0-72.8 r 550-770 y 5860-8200 c 7.0-9.8 k 72.8-102 s 770-1100 z1 8-10cd d 9.8-13.7 l 102-145 t 1100-1520 z2 10-12cd e 13.7-19.0 m 145-200 u 1520-2130 z3 12-14cd f 19.0-26.6 n 200-280 v 2130-3000 z4 14-16cd g 26.6-37.2 p 280-390 w 3000-4180 z5 16-18cd ligth col. bin code wavel. (nm) ligth col. bin code wavel. (nm) b1 450-455 yg1 555-558 b2 455-460 yg2 558-561 b3 460-465 yg3 561-564 b4 465-470 yg4 564-567 b5 470-475 yg5 567-570 b6 475-480 yg6 570-573 g1 491-494 yg7 573-576 g2 494-497 y1 582-585 g3 497-500 y2 585-588 g4 500-503 y3 588-591 g5 503-506 y4 591-594 g6 506-509 y5 594-597 g7 509-512 yo1 597-600 g8 512-515 yo2 600-603 g9 515-518 yo3 603-606 g10 518-521 yo4 606-609 g11 521-524 o1 609-612 g12 524-527 o2 612-615 g13 527-530 o3 615-618 g14 530-533 r1 618-621 g15 533-536 r2 621-624 g16 536-539 r3 624-627 g17 539-542 r4 627-630 g18 542-545 r5 630-633 g19 545-548 r6 633-636 bin code vf (v) bin code vf (v) bin code vf (v) bin code vf (v) v1 1.6-1.8 v5 2.4-2.6 v9 3.2-3.4 v13 4.0-4.2 v2 1.8-2.0 v6 2.6-2.8 v10 3.4-3.6 v14 4.2-4.4 v3 2.0-2.2 v7 2.8-3.0 v11 3.6-3.8 v15 4.4-4.6 v4 2.2-2.4 v8 3.0-3.2 v12 3.8-4.0 v16 4.6-4.8 brightness bin yellow yellow orange pure orange yellow green blue green forward voltage (vf) bin red blue wavelength bin pure green bin ranking for leds page:4
led lamp application soldering method soldering conditions remark dip soldering bath temperature: 2605 immersion time: with 5 sec solder no closer than 3mm from the base of the package using soldering flux, resin flux is recommended. soldering iron soldering iron: 30w or smaller t emperature at tip of iron: 260 or lowe r soldering time: within 5 sec. during soldering, take care not to press the tip of iron against the lead. (to prevent heat from being transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) when soldering the lead of led in a condition that the package is fixed with a panel (see fig.1), be careful not to stress the leads with iron tip. 2) when soldering wire to the lead, work with a fig (see fig.2) to avoid stressing the package. page : 5

3) similarly, when a jig is used to solder the led to pc board, take care as much as possible to avoid steering the leads (see fig.3). 4) repositioning after soldering should be avoided as much as possible. if inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the led. 5) lead cutting after soldering should be performed only after the led temperature has returned to normal temperature. led mounting method 1) when mounting the led by using a case, as shown fig.4, ensure that the mounting holds on the pc board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the led should be taken into account especially when designing the case, pc board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. alternatively, the shape of the holes should be made oval. (see fig.4) page : 6
fig.4 case pc board led lamp application
2) use leds with stand-off (fig.5) or the tube or spacer made of resin (fig.6) to position the leds. formed lead 1) the lead should be bent at a point located at least 2mm away from the package. bending should be performed with base fixed means of a jig or pliers (fig.7) 2) forming lead should be carried our prior to soldering and never during or after soldering. 3) form the lead to ensure alignment between the leads and the hole on board, so that stress against the led is prevented. (fig.8) page : 7 stand-off fig.5 fig.6 tube led lamp application
lead strength 1) bend strength do not bend the lead more than twice. (fig.9) 2) tensile strength (@room temperature) if the force is 1kg or less, there will be no problem. (fig.10) handling precautions although rigid against vibration, the leds may damaged or scratched if dropped. so take care when handling. chemical resistance 1) avoid exposure to chemicals as it may attack the led surface and cause discoloration. 2) when washing is required, refer to the following table for the proper chemical to be sued. (immersion time: within 3 minutes at room temperature.) solvent adaptability freon te chlorothene isopropyl alcohol thinner acetone trichloroethylene --usable --do not use. page : 8 fig.9 fig.10 note: influences of ultrasonic cleaning of the led resin body differ depending on such factors as the oscillator output, size of the pc board and the way in which the led is mounted. therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. led lamp application
experiment item: test condition item lamp & ir reference standard operation life ta 25 5 if= 20ma rh =60%rh dynamic:100ma 1ms 1/10 duty static state: if 20ma test time: 168hrs -24hrs +24hrs
500hrs -24hrs +24hrs
1000hrs -24hrs +72hrs
mil-std-750 1026 mil-std-883 1005 jis c 7021 b-1 high temperature high humidity storage ta 65 5 rh 90 95%rh test time 240hrs 2hrs mil-std-202 103b jis c 7021 b-1 temperature cycling 105 25 -55 25 30min 5min 30min 5min 10cycles mil-std-202 107d mil-std-750 1051 mil-std-883 1010 jis c 7021 a-4 thermal shock 105 5 -55 5 10min 10min 10cycles mil-std-202 107d mil-std-750 1051 mil-syd-883 1011 solder resistance t sol 260 5 dwell time 10 lsec mil-std-202 210a mil-std-750-2031 jis c 7021 a-1 solderability t sol 230 5 dwell time 5 lsec mil-std-202 208d mil-std-750 2026 mil-std-883 2003 jis c 7021 a-2 page : 9 led lamp passed tests drive method circuit model a circuit model b (a)recommended circuit. (b)the difference of brightness between led`s could be found due to the vf-if characteristics of led.

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